Microsoft in talks with TSMC for more than 300,000 Maia 300 AI chips

Microsoft is negotiating TSMC capacity for more than 300,000 Maia 300 accelerators for 2027 delivery, with the chip due to be unveiled this fall, possibly in September, per The Information. Committing to that volume before the part is announced is a real bet on in-house inference silicon, and Microsoft is pitching it to cloud customers including Anthropic, which is staffing its own chip team. The shipping Maia 200 is a 3nm inference-only part with 216 GB of HBM3e and over 10 petaFLOPS at 4-bit inside 750 watts.

Source: techzine.eu ↗