
TSMC runs ahead of schedule on $49B 1.4nm fab, eyeing mid-2028 mass production
TSMC is ahead of schedule on its $49 billion 1.4nm fab in Taichung's Central Taiwan Science Park, with first silicon possible in April 2027, trial production in Q3 2027, and mass production by mid-2028. Hitting that timeline on second-generation gate-all-around transistors, without ASML's High-NA EUV tools, puts TSMC level with Intel's 2028 volume plan and a year ahead of Samsung's 2029 target for the same node.
Source: electronicsweekly.com ↗
First silicon could be running in April 2027 and, if that goes well, the first trial production run could be in Q3 2027.
Commercial Times
Why this matters
- → TSMC reaches mass production a year ahead of Samsung, solidifying foundry leadership
- → Achieving 1.4nm without High-NA EUV reveals process maturity independent of ASML roadmap
- → Mid-2028 timeline matches Intel's volume plans, reshaping competitive semiconductor manufacturing
Taiwan's manufacturing sprint